Samsung’s love for the 3.5mm headphone jack continues unabated with the upcoming Galaxy S9 and S9 Plus devices too likely featuring the same if a new leak on this is to be believed. The said leak again portrays the actual circuit board applicable to the 3.5mm headphone jack circuitry which will go into the making of the next Samsung ‘S’ series flagship due out in spring.
A closer inspection of the circuit board reveals the model number SM-G965F. That is believed to be applicable to a single SIM variant of the S9 that would go on sale in some countries. That said, the headphone jack will no doubt be a standard S9 feature that applies to all models of the phone to be sold anywhere in the world.
Another report however point out the lack of enough safe guard to ensure water proofing though that isn’t likely to be the case with the final production models. Samsung has been very avid in portraying the water proofing ability of its flagship handsets vis-a-vis its competitors, read Apple’s iPhone. That also is the very reason the S9 isn’t likely to miss out on this key feature.
Coming back to the once ubiquitous 3.5mm headphone jack, Samsung happens to be among the new found minority that still is being loyal to the headphone unit. That again should be heartening for the traditional music lovers who have already invested in gears and accessories based on the headphone jack.
Apple, on the other hand, already has turned away from the 3.5mm slot and that seems permanent as well. So the best the users of the latest Apple iPhone can do is use an adapter as an interface to continue using their 3.5mm headphones.
As for the rest of the leaks pertaining to the S9, the upcoming flagship might yet continue with a single lens camera, as has been revealed in another leak. However, the fingerprint sensor might be relocated to a more central position just beneath the camera for ease of access.
As for its internal specs, the phone would be powered by the Snapdragon 845 SoC and will have 64 gigs of memory in the base unit. The rest of the specs are still shrouded in mystery.